SILICON WAFERS DIAM. 100 MM, TYPE P/BORON, THICKNESS: 525+/-25µm - 25 BUC; SILICON WAFERS DIAM. 100 MM, TYPE N/PHOS, THICKNESS: 525+/-25µm - 25 BUC; SILICON WAFERS DIAM. 100 MM, TYPE P/BORON, THICKNESS: 381+/-25µm - 100 BUC; SILICON WAFERS DIAM. 100 MM, TYPE N/PHOS, THICKNESS: 381+/-25µm - 100 BUC

Purchaser

INSTITUTUL NATIONAL DE CERCETARE-DEZVOLTARE PENTRU FIZICA MATERIALELOR
Publication date

Jan 30, 2020
Source

SEAP