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1.GLASS-BF33-0003, BF33 Wafers diameter: 4", thickness: 0.5mm+/-50um, double sides polished, surfaces roughness Ra:<=1.5nm, primary referance flat : 32.5+/-1.5mm; TTV:<10UM, Edge rounding- 50 pc 2.SUSTO-WACA-0005 SP5-S4, 4" Single Wafer Carrier: 25 pc 3.DELIV-SALE-0013 Delivery Charge-1pc

  • Purchaser

    INSTITUTUL NATIONAL DE CERCETARE-DEZVOLTARE PENTRU FIZICA MATERIALELOR

  • Publication date

    Nov 15, 2021

  • Source

    SEAP

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Data source: SEAP

This project has received funding from the European Union’s Internal Security Fund-Police under Grant Agreement No 823833.